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Essentially, a sputtering target is a disc or sheet of a certain material that is used in the process of sputter deposition to coat a substrate. This is a physical vapor deposition (PVD) mechanism with many uses in modern technology and manufacturing.
In the sputtering process, within the vacuum state maintained in a sputtering machine, the sputtering target is bombarded by ions. This causes the atoms in the sputtering target to be ejected, and as they fall from the surface of the target, they coat a substrate like a silicon wafer or a glass sheet. The coating created on the substrate is used in a variety of applications, such as decorative coatings or solar cells. sputtering targets are also commonly used in microelectronics to create thin film semiconductor devices.
A sputter target is usually made of a metallic material or an alloy. It can also be bonded with another material to increase its strength, or it may even have multiple metals fused together to produce an extremely strong target. In addition to metal sputtering targets, there are also ceramic sputtering targets available that can be used to strengthen molds and tools.
Typically, sputter targets are rectangular or circular, but a number of suppliers are now able to provide a target in almost any shape. They can also be shaped to rotate, which offers more precise thin-film deposition. The rotational sputtering targets are very useful for producing low-radiation coated glass, which is often used in construction to save energy and control light.